Click to learn more about the opportunity! OPEN RFPs Anna Briones 2/11/26 Anna Briones 2/11/26 DQ35004 – Selective Solder Feature Deposition and Joint Formation System – Documented Quote Questions – Responses to Written Inquiries Read More Anna Briones 2/11/26 Anna Briones 2/11/26 DQ35003 – Sub-Micron Die Attach and Flip-Chip Bonding System – Documented Quote Questions – Responses to Written Inquiries Read More Anna Briones 1/28/26 Anna Briones 1/28/26 DQ35003 - Sub-Micron Die Attach and Flip-Chip Bonding System Read More Anna Briones 1/28/26 Anna Briones 1/28/26 DQ35004 - Selective Solder Feature Deposition and Joint Formation System Read More Anna Briones 12/8/25 Anna Briones 12/8/25 Modular Cleanroom for Advanced Packaging - RFP Read More Anna Briones 9/9/25 Anna Briones 9/9/25 ICP-RIE Etcher (2 Systems), ICP-Plasma Enhanced Chemical Vapor Disposition and Deep Reactive Ion Etching RFP Read More Anna Briones 3/12/25 Anna Briones 3/12/25 Purchase Order Terms & Conditions Read More
Anna Briones 2/11/26 Anna Briones 2/11/26 DQ35004 – Selective Solder Feature Deposition and Joint Formation System – Documented Quote Questions – Responses to Written Inquiries Read More
Anna Briones 2/11/26 Anna Briones 2/11/26 DQ35003 – Sub-Micron Die Attach and Flip-Chip Bonding System – Documented Quote Questions – Responses to Written Inquiries Read More
Anna Briones 1/28/26 Anna Briones 1/28/26 DQ35003 - Sub-Micron Die Attach and Flip-Chip Bonding System Read More
Anna Briones 1/28/26 Anna Briones 1/28/26 DQ35004 - Selective Solder Feature Deposition and Joint Formation System Read More
Anna Briones 9/9/25 Anna Briones 9/9/25 ICP-RIE Etcher (2 Systems), ICP-Plasma Enhanced Chemical Vapor Disposition and Deep Reactive Ion Etching RFP Read More
